[QUOTE=taipan;34648580]I fixed a friend yrod by doing the following:
1:Open it up,
2:Get all the dust out
3:remove thermal paste and cooling pads (thick fabric like thingies)
4:Replace with new thermal pads and paste.
5:Screw it back together.
6:Profit.
there are tuttorials online on how to do this.[/QUOTE]
This, but you need to reflow the board with a heatgun for it to last
I just fixed my YLOD yesterday and it was really easy.
I found [url=http://www.youtube.com/watch?v=U70SgRDVcBo]THIS[/url] tutorial very helpful
When i tried the heatgun method all it did was make the board the shape of a banana :v:
[QUOTE=taipan;34648580]I fixed a friend yrod by doing the following:
1:Open it up,
2:Get all the dust out
3:remove thermal paste and cooling pads (thick fabric like thingies)
4:Replace with new thermal pads and paste.
5:Screw it back together.
6:Profit.
there are tuttorials online on how to do this.[/QUOTE]
that's because it's a ball socket processor and they tend to come loose when the system overheats
Use it as a concrete bomb
[QUOTE=Applecrap;34746291]that's because it's a ball socket processor and they tend to come loose when the system overheats[/QUOTE]
It's the crap lead free solder that is used
it has a lower melting point
[editline]17th February 2012[/editline]
The socket is BGA too
[QUOTE=taipan;34648580]I fixed a friend yrod by doing the following:
1:Open it up,
2:Get all the dust out
3:remove thermal paste and cooling pads (thick fabric like thingies)
4:Replace with new thermal pads and paste.
5:Screw it back together.
6:Profit.
there are tuttorials online on how to do this.[/QUOTE]
This will only improve cooling and prevent future heating. It does nothing if the solder balls are already warped/damaged by the heat.
[QUOTE='[EG] Pepper;34740080']When i tried the heatgun method all it did was make the board the shape of a banana :v:[/QUOTE]
Oh wow, you must have done something seriously wrong
350°C for 15 seconds on each BGA and its IC, wait 15 mins, flip over and do the same on the other side.
I think it's because the board was being suspended by the ends only
I used a heatgun at 350 degrees for 25 seconds on each chip
[editline]18th February 2012[/editline]
and waited 20 minutes between sides
25 seconds isn't really enough to fully melt the solder, assuming that's celcius.
Well what is then?
make it to a grill to put in your backyard!!!
I remember someone on FP built a PC in their xbox. You could try that.
beat a kid to death with the fucker
[QUOTE=FullStreak12;34764468]I remember someone on FP built a PC in their xbox. You could try that.[/QUOTE]
That was me
[url]http://www.facepunch.com/threads/1026728?highlight=[/url]
[QUOTE=B!N4RY;34761322]25 seconds isn't really enough to fully melt the solder, assuming that's celcius.[/QUOTE]
15 seconds at 350C was fine for me, worked like a charm.
On the less-serious side, you could take the components out and use the split case to make a supercool breastplate. I'm also probably going to use my old enormous PS2 to make a mini PC, you could do that.
LALALALA
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